Multiamino Polydiacetylene-Mediated Interfacial Engineering of Boron Nitride Nanosheet/Polyimide Composites for Low-Dielectric Thermal Management.

Wang R, Zhang B, Cheng B, Wan F, Guang S, Xu H

Open source

DOI
10.1021/acsami.6c16557
Published
2026 Oct 30
Container
ACS applied materials & interfaces
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1021/acsami.6c16557,
  title = {Multiamino Polydiacetylene-Mediated Interfacial Engineering of Boron Nitride Nanosheet/Polyimide Composites for Low-Dielectric Thermal Management.},
  author = {Wang R and Zhang B and Cheng B and Wan F and Guang S and Xu H},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c16557},
  url = {https://doi.org/10.1021/acsami.6c16557}
}

RIS

TY  - JOUR
TI  - Multiamino Polydiacetylene-Mediated Interfacial Engineering of Boron Nitride Nanosheet/Polyimide Composites for Low-Dielectric Thermal Management.
AU  - Wang R
AU  - Zhang B
AU  - Cheng B
AU  - Wan F
AU  - Guang S
AU  - Xu H
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c16557
UR  - https://doi.org/10.1021/acsami.6c16557
ER  - 

APA

R, W., B, Z., B, C., F, W., S, G., & H, X. (2026). Multiamino Polydiacetylene-Mediated Interfacial Engineering of Boron Nitride Nanosheet/Polyimide Composites for Low-Dielectric Thermal Management.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c16557

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