In Situ Displacement Reaction Enables a Conductive Metallized Hydrogel Interface for Smart Underwater Flexible Electronics.
- DOI
- 10.1021/acsami.6c16654
- Published
- 2026 Nov 10
- Container
- ACS applied materials & interfaces
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.6c16654,
title = {In Situ Displacement Reaction Enables a Conductive Metallized Hydrogel Interface for Smart Underwater Flexible Electronics.},
author = {Zhao W and Zhang X and Feng Y and Huang Z and Jiao B and Peng L and Kong L and Shang Y and Wang Q},
year = {2026},
journal = {ACS applied materials \& interfaces},
doi = {10.1021/acsami.6c16654},
url = {https://doi.org/10.1021/acsami.6c16654}
}RIS
TY - JOUR TI - In Situ Displacement Reaction Enables a Conductive Metallized Hydrogel Interface for Smart Underwater Flexible Electronics. AU - Zhao W AU - Zhang X AU - Feng Y AU - Huang Z AU - Jiao B AU - Peng L AU - Kong L AU - Shang Y AU - Wang Q PY - 2026 JO - ACS applied materials & interfaces DO - 10.1021/acsami.6c16654 UR - https://doi.org/10.1021/acsami.6c16654 ER -
APA
W, Z., X, Z., Y, F., Z, H., B, J., L, P., L, K., Y, S., & Q, W. (2026). In Situ Displacement Reaction Enables a Conductive Metallized Hydrogel Interface for Smart Underwater Flexible Electronics.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c16654
Source records
- pubmed · retrieved 2026-11-10T18:11:13.820Z