Engineered Dielectric Response of Liquid-Filled Interfacial Bubbles in van der Waals Heterostructures

Jiyu Park, Dongjae Lee, Jeongwon Lee, Hyeongyu Choi, Taewoong Kim, Taekyeong Kim

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DOI: 10.1021/acsami.6c16676
Published: 2026-11-05
Container: ACS Applied Materials & Interfaces
Publisher: American Chemical Society (ACS)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c16676,
  title = {Engineered Dielectric Response of Liquid-Filled Interfacial Bubbles in van der Waals Heterostructures},
  author = {Jiyu Park and Dongjae Lee and Jeongwon Lee and Hyeongyu Choi and Taewoong Kim and Taekyeong Kim},
  year = {2026},
  journal = {ACS Applied Materials \&amp; Interfaces},
  doi = {10.1021/acsami.6c16676},
  url = {https://doi.org/10.1021/acsami.6c16676}
}

RIS

TY  - JOUR
TI  - Engineered Dielectric Response of Liquid-Filled Interfacial Bubbles in van der Waals Heterostructures
AU  - Jiyu Park
AU  - Dongjae Lee
AU  - Jeongwon Lee
AU  - Hyeongyu Choi
AU  - Taewoong Kim
AU  - Taekyeong Kim
PY  - 2026
JO  - ACS Applied Materials &amp; Interfaces
DO  - 10.1021/acsami.6c16676
UR  - https://doi.org/10.1021/acsami.6c16676
ER  -

APA

Park, J., Lee, D., Lee, J., Choi, H., Kim, T., & Kim, T. (2026). Engineered Dielectric Response of Liquid-Filled Interfacial Bubbles in van der Waals Heterostructures. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.6c16676

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crossref · retrieved 2026-11-07T14:11:52.646Z