Two-Stage Electromigration Mechanism in Cu-Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy.
- DOI
- 10.1021/acsnano.6c06734
- Published
- 2026 Jul 28
- Container
- ACS nano
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsnano.6c06734,
title = {Two-Stage Electromigration Mechanism in Cu-Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy.},
author = {Park EB and Jung MH and Kim SJ and Yang SH and Jeong SY and Jeong HY and Kim YM},
year = {2026},
journal = {ACS nano},
doi = {10.1021/acsnano.6c06734},
url = {https://doi.org/10.1021/acsnano.6c06734}
}RIS
TY - JOUR TI - Two-Stage Electromigration Mechanism in Cu-Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy. AU - Park EB AU - Jung MH AU - Kim SJ AU - Yang SH AU - Jeong SY AU - Jeong HY AU - Kim YM PY - 2026 JO - ACS nano DO - 10.1021/acsnano.6c06734 UR - https://doi.org/10.1021/acsnano.6c06734 ER -
APA
EB, P., MH, J., SJ, K., SH, Y., SY, J., HY, J., & YM, K. (2026). Two-Stage Electromigration Mechanism in Cu-Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy.. ACS nano. https://doi.org/10.1021/acsnano.6c06734
Source records
- pubmed · retrieved 2026-09-25T16:54:15.968Z