Plasma-Assisted Surface Functionalization for High-Strength, Thermally Stable Copper Plating on Cycloolefin Polymer Films

Jing Sang, Sumio Aisawa, Chika Chida, Dexin Chen, Di Wang, Hidetoshi Hirahara

Open source

DOI: 10.1021/acsomega.5c04758
Published: 2025-08-28
Container: ACS Omega
Publisher: American Chemical Society (ACS)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsomega.5c04758,
  title = {Plasma-Assisted Surface Functionalization for High-Strength, Thermally Stable Copper Plating on Cycloolefin Polymer Films},
  author = {Jing Sang and Sumio Aisawa and Chika Chida and Dexin Chen and Di Wang and Hidetoshi Hirahara},
  year = {2025},
  journal = {ACS Omega},
  doi = {10.1021/acsomega.5c04758},
  url = {https://doi.org/10.1021/acsomega.5c04758}
}

RIS

TY  - JOUR
TI  - Plasma-Assisted Surface Functionalization for High-Strength, Thermally Stable Copper Plating on Cycloolefin Polymer Films
AU  - Jing Sang
AU  - Sumio Aisawa
AU  - Chika Chida
AU  - Dexin Chen
AU  - Di Wang
AU  - Hidetoshi Hirahara
PY  - 2025
JO  - ACS Omega
DO  - 10.1021/acsomega.5c04758
UR  - https://doi.org/10.1021/acsomega.5c04758
ER  -

APA

Sang, J., Aisawa, S., Chida, C., Chen, D., Wang, D., & Hirahara, H. (2025). Plasma-Assisted Surface Functionalization for High-Strength, Thermally Stable Copper Plating on Cycloolefin Polymer Films. ACS Omega. https://doi.org/10.1021/acsomega.5c04758

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crossref · retrieved 2026-11-07T21:59:33.086Z