Design of Cu/Zr Alloy Interface for Enhanced Thermal Fatigue Performance in Electronic Packaging.

Ferguson JB, Kanel SR, Jones JG, Shenogin SV, Sihn S, Mahalingam K, Wheeler RA, Bowers CT, Islam MS, Roy AK

DOI: 10.1021/acsomega.5c06959
Published: 2025 Sep 2
Container: ACS omega
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1021/acsomega.5c06959,
  title = {Design of Cu/Zr Alloy Interface for Enhanced Thermal Fatigue Performance in Electronic Packaging.},
  author = {Ferguson JB and Kanel SR and Jones JG and Shenogin SV and Sihn S and Mahalingam K and Wheeler RA and Bowers CT and Islam MS and Roy AK},
  year = {2025},
  journal = {ACS omega},
  doi = {10.1021/acsomega.5c06959},
  url = {https://doi.org/10.1021/acsomega.5c06959}
}

RIS

TY  - JOUR
TI  - Design of Cu/Zr Alloy Interface for Enhanced Thermal Fatigue Performance in Electronic Packaging.
AU  - Ferguson JB
AU  - Kanel SR
AU  - Jones JG
AU  - Shenogin SV
AU  - Sihn S
AU  - Mahalingam K
AU  - Wheeler RA
AU  - Bowers CT
AU  - Islam MS
AU  - Roy AK
PY  - 2025
JO  - ACS omega
DO  - 10.1021/acsomega.5c06959
UR  - https://doi.org/10.1021/acsomega.5c06959
ER  -

APA

JB, F., SR, K., JG, J., SV, S., S, S., K, M., RA, W., CT, B., MS, I., & AK, R. (2025). Design of Cu/Zr Alloy Interface for Enhanced Thermal Fatigue Performance in Electronic Packaging.. ACS omega. https://doi.org/10.1021/acsomega.5c06959

Source records

pubmed · retrieved 2026-09-26T19:17:42.342Z