Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging.

Noh T, Noh EC, Sung M, Yoon J, Seong HK, Kang DG, Yoon JW, Jung SB

DOI: 10.1021/acsomega.5c08402
Published: 2025 Nov 18
Container: ACS omega
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1021/acsomega.5c08402,
  title = {Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging.},
  author = {Noh T and Noh EC and Sung M and Yoon J and Seong HK and Kang DG and Yoon JW and Jung SB},
  year = {2025},
  journal = {ACS omega},
  doi = {10.1021/acsomega.5c08402},
  url = {https://doi.org/10.1021/acsomega.5c08402}
}

RIS

TY  - JOUR
TI  - Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging.
AU  - Noh T
AU  - Noh EC
AU  - Sung M
AU  - Yoon J
AU  - Seong HK
AU  - Kang DG
AU  - Yoon JW
AU  - Jung SB
PY  - 2025
JO  - ACS omega
DO  - 10.1021/acsomega.5c08402
UR  - https://doi.org/10.1021/acsomega.5c08402
ER  -

APA

T, N., EC, N., M, S., J, Y., HK, S., DG, K., JW, Y., & SB, J. (2025). Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging.. ACS omega. https://doi.org/10.1021/acsomega.5c08402

Source records

pubmed · retrieved 2026-09-26T08:15:41.708Z
europe-pmc · retrieved 2026-09-26T08:15:41.740Z