Binder-Free MoS(2)@TiO(2) Heterojunction by In-Situ Magnetron Sputtering: Interfacial Defect Engineering for Fast-Charging Anodes.

Zhang Y, Zeng X, Jin N, Kang Q, Tong P, Li Z, Wang L, Liu L

DOI: 10.1021/acsomega.6c04090
Published: 2026 Sep 22
Container: ACS omega
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1021/acsomega.6c04090,
  title = {Binder-Free MoS(2)@TiO(2) Heterojunction by In-Situ Magnetron Sputtering: Interfacial Defect Engineering for Fast-Charging Anodes.},
  author = {Zhang Y and Zeng X and Jin N and Kang Q and Tong P and Li Z and Wang L and Liu L},
  year = {2026},
  journal = {ACS omega},
  doi = {10.1021/acsomega.6c04090},
  url = {https://doi.org/10.1021/acsomega.6c04090}
}

RIS

TY  - JOUR
TI  - Binder-Free MoS(2)@TiO(2) Heterojunction by In-Situ Magnetron Sputtering: Interfacial Defect Engineering for Fast-Charging Anodes.
AU  - Zhang Y
AU  - Zeng X
AU  - Jin N
AU  - Kang Q
AU  - Tong P
AU  - Li Z
AU  - Wang L
AU  - Liu L
PY  - 2026
JO  - ACS omega
DO  - 10.1021/acsomega.6c04090
UR  - https://doi.org/10.1021/acsomega.6c04090
ER  -

APA

Y, Z., X, Z., N, J., Q, K., P, T., Z, L., L, W., & L, L. (2026). Binder-Free MoS(2)@TiO(2) Heterojunction by In-Situ Magnetron Sputtering: Interfacial Defect Engineering for Fast-Charging Anodes.. ACS omega. https://doi.org/10.1021/acsomega.6c04090

Source records

pubmed · retrieved 2026-09-27T10:25:59.466Z