Building Up Debondable Adhesion with Commercial Adhesives through Surface Modification of Substrate with Vitrimers

Nien-Hsun Wu, Ying-Ling Liu

Open source

DOI: 10.1021/acspolymersau.6c00122
Published: 2026-08-21
Container: ACS Polymers Au
Publisher: American Chemical Society (ACS)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acspolymersau.6c00122,
  title = {Building Up
Debondable Adhesion with Commercial Adhesives
through Surface Modification of Substrate with Vitrimers},
  author = {Nien-Hsun Wu and Ying-Ling Liu},
  year = {2026},
  journal = {ACS Polymers Au},
  doi = {10.1021/acspolymersau.6c00122},
  url = {https://doi.org/10.1021/acspolymersau.6c00122}
}

RIS

TY  - JOUR
TI  - Building Up
Debondable Adhesion with Commercial Adhesives
through Surface Modification of Substrate with Vitrimers
AU  - Nien-Hsun Wu
AU  - Ying-Ling Liu
PY  - 2026
JO  - ACS Polymers Au
DO  - 10.1021/acspolymersau.6c00122
UR  - https://doi.org/10.1021/acspolymersau.6c00122
ER  -

APA

Wu, N., & Liu, Y. (2026). Building Up Debondable Adhesion with Commercial Adhesives through Surface Modification of Substrate with Vitrimers. ACS Polymers Au. https://doi.org/10.1021/acspolymersau.6c00122

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crossref · retrieved 2026-11-10T14:57:30.711Z