Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives.

Berne C, Marsan-Loyer C, Weiss LE, Brun Y, Danovitch D, Gendron D, Ecoffey S

Open source

DOI
10.1021/acssuschemeng.5c08258
Published
2025 Dec 1
Container
ACS sustainable chemistry & engineering
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.1021/acssuschemeng.5c08258,
  title = {Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives.},
  author = {Berne C and Marsan-Loyer C and Weiss LE and Brun Y and Danovitch D and Gendron D and Ecoffey S},
  year = {2025},
  journal = {ACS sustainable chemistry \& engineering},
  doi = {10.1021/acssuschemeng.5c08258},
  url = {https://doi.org/10.1021/acssuschemeng.5c08258}
}

RIS

TY  - JOUR
TI  - Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives.
AU  - Berne C
AU  - Marsan-Loyer C
AU  - Weiss LE
AU  - Brun Y
AU  - Danovitch D
AU  - Gendron D
AU  - Ecoffey S
PY  - 2025
JO  - ACS sustainable chemistry & engineering
DO  - 10.1021/acssuschemeng.5c08258
UR  - https://doi.org/10.1021/acssuschemeng.5c08258
ER  - 

APA

C, B., C, M., LE, W., Y, B., D, D., D, G., & S, E. (2025). Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives.. ACS sustainable chemistry & engineering. https://doi.org/10.1021/acssuschemeng.5c08258

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