Zinc Plating on Copper Proceeds via Breakdown of a Capacitive Electric Double Layer.

Sun H, Ding S, Zhang J, Chen Y, Wu X, Zhang Z, Zhou T, Yan Z, Zhang K, Zhao Q, Xie W, Yang K, Feng G, Nakamura E, Chen J, Zhang W

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DOI: 10.1021/jacs.5c17948
Published: 2025 Dec 24
Container: Journal of the American Chemical Society
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/jacs.5c17948,
  title = {Zinc Plating on Copper Proceeds via Breakdown of a Capacitive Electric Double Layer.},
  author = {Sun H and Ding S and Zhang J and Chen Y and Wu X and Zhang Z and Zhou T and Yan Z and Zhang K and Zhao Q and Xie W and Yang K and Feng G and Nakamura E and Chen J and Zhang W},
  year = {2025},
  journal = {Journal of the American Chemical Society},
  doi = {10.1021/jacs.5c17948},
  url = {https://doi.org/10.1021/jacs.5c17948}
}

RIS

TY  - JOUR
TI  - Zinc Plating on Copper Proceeds via Breakdown of a Capacitive Electric Double Layer.
AU  - Sun H
AU  - Ding S
AU  - Zhang J
AU  - Chen Y
AU  - Wu X
AU  - Zhang Z
AU  - Zhou T
AU  - Yan Z
AU  - Zhang K
AU  - Zhao Q
AU  - Xie W
AU  - Yang K
AU  - Feng G
AU  - Nakamura E
AU  - Chen J
AU  - Zhang W
PY  - 2025
JO  - Journal of the American Chemical Society
DO  - 10.1021/jacs.5c17948
UR  - https://doi.org/10.1021/jacs.5c17948
ER  -

APA

H, S., S, D., J, Z., Y, C., X, W., Z, Z., T, Z., Z, Y., K, Z., Q, Z., W, X., K, Y., G, F., E, N., J, C., & W, Z. (2025). Zinc Plating on Copper Proceeds via Breakdown of a Capacitive Electric Double Layer.. Journal of the American Chemical Society. https://doi.org/10.1021/jacs.5c17948

Source records

pubmed · retrieved 2026-09-26T10:36:35.949Z