Engineering In-Plane Anisotropy in 2D Materials via Surface-Bound Ligands.

Sakurada T, Lee WS, Cho Y, Khamlue R, Chatsiri P, Samulewicz N, Deshpande T, Su A, Müller P, Kawamoto T, Omagari S, Vacha M, Paritmongkol W, Kulik HJ, Tisdale WA

Open source

DOI
10.1021/jacs.6c09871
Published
2026 Sep 9
Container
Journal of the American Chemical Society
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1021/jacs.6c09871,
  title = {Engineering In-Plane Anisotropy in 2D Materials via Surface-Bound Ligands.},
  author = {Sakurada T and Lee WS and Cho Y and Khamlue R and Chatsiri P and Samulewicz N and Deshpande T and Su A and Müller P and Kawamoto T and Omagari S and Vacha M and Paritmongkol W and Kulik HJ and Tisdale WA},
  year = {2026},
  journal = {Journal of the American Chemical Society},
  doi = {10.1021/jacs.6c09871},
  url = {https://doi.org/10.1021/jacs.6c09871}
}

RIS

TY  - JOUR
TI  - Engineering In-Plane Anisotropy in 2D Materials via Surface-Bound Ligands.
AU  - Sakurada T
AU  - Lee WS
AU  - Cho Y
AU  - Khamlue R
AU  - Chatsiri P
AU  - Samulewicz N
AU  - Deshpande T
AU  - Su A
AU  - Müller P
AU  - Kawamoto T
AU  - Omagari S
AU  - Vacha M
AU  - Paritmongkol W
AU  - Kulik HJ
AU  - Tisdale WA
PY  - 2026
JO  - Journal of the American Chemical Society
DO  - 10.1021/jacs.6c09871
UR  - https://doi.org/10.1021/jacs.6c09871
ER  - 

APA

T, S., WS, L., Y, C., R, K., P, C., N, S., T, D., A, S., P, M., T, K., S, O., M, V., W, P., HJ, K., & WA, T. (2026). Engineering In-Plane Anisotropy in 2D Materials via Surface-Bound Ligands.. Journal of the American Chemical Society. https://doi.org/10.1021/jacs.6c09871

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