Fluid drawing printing 3D conductive structures for flexible circuit manufacturing

Yikang Li, Dazhi Wang, Yiwen Feng, Xiangji Chen, Xu Chen, Chang Liu, Yanteng Li, Liujia Suo, Ran Zhang, Xiaopeng Zhang, Ben Liu, Fengshu Wang, Shiwen Liang, Lingjie Kong, Qiang Fu, Tongqun Ren, Tiesheng Wang

Open source

DOI
10.1038/s41378-025-00936-0
Published
2025-05-12
Container
Microsystems & Nanoengineering
Publisher
Springer Science and Business Media LLC
Open access
unknown

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Cite this work

BibTeX

@article{allodium:10.1038/s41378-025-00936-0,
  title = {Fluid drawing printing 3D conductive structures for flexible circuit manufacturing},
  author = {Yikang Li and Dazhi Wang and Yiwen Feng and Xiangji Chen and Xu Chen and Chang Liu and Yanteng Li and Liujia Suo and Ran Zhang and Xiaopeng Zhang and Ben Liu and Fengshu Wang and Shiwen Liang and Lingjie Kong and Qiang Fu and Tongqun Ren and Tiesheng Wang},
  year = {2025},
  journal = {Microsystems \& Nanoengineering},
  doi = {10.1038/s41378-025-00936-0},
  url = {https://doi.org/10.1038/s41378-025-00936-0}
}

RIS

TY  - JOUR
TI  - Fluid drawing printing 3D conductive structures for flexible circuit manufacturing
AU  - Yikang Li
AU  - Dazhi Wang
AU  - Yiwen Feng
AU  - Xiangji Chen
AU  - Xu Chen
AU  - Chang Liu
AU  - Yanteng Li
AU  - Liujia Suo
AU  - Ran Zhang
AU  - Xiaopeng Zhang
AU  - Ben Liu
AU  - Fengshu Wang
AU  - Shiwen Liang
AU  - Lingjie Kong
AU  - Qiang Fu
AU  - Tongqun Ren
AU  - Tiesheng Wang
PY  - 2025
JO  - Microsystems & Nanoengineering
DO  - 10.1038/s41378-025-00936-0
UR  - https://doi.org/10.1038/s41378-025-00936-0
ER  - 

APA

Li, Y., Wang, D., Feng, Y., Chen, X., Chen, X., Liu, C., Li, Y., Suo, L., Zhang, R., Zhang, X., Liu, B., Wang, F., Liang, S., Kong, L., Fu, Q., Ren, T., & Wang, T. (2025). Fluid drawing printing 3D conductive structures for flexible circuit manufacturing. Microsystems & Nanoengineering. https://doi.org/10.1038/s41378-025-00936-0

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