Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions
- DOI
- 10.1038/s41378-025-00994-4
- Published
- 2025-08-12
- Container
- Microsystems & Nanoengineering
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s41378-025-00994-4,
title = {Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions},
author = {Feixiang Tang and Siyu He and Yuhan Li and wenjin Liu and Fang Dong and Sheng Liu},
year = {2025},
journal = {Microsystems \& Nanoengineering},
doi = {10.1038/s41378-025-00994-4},
url = {https://doi.org/10.1038/s41378-025-00994-4}
}RIS
TY - JOUR TI - Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions AU - Feixiang Tang AU - Siyu He AU - Yuhan Li AU - wenjin Liu AU - Fang Dong AU - Sheng Liu PY - 2025 JO - Microsystems & Nanoengineering DO - 10.1038/s41378-025-00994-4 UR - https://doi.org/10.1038/s41378-025-00994-4 ER -
APA
Tang, F., He, S., Li, Y., Liu, W., Dong, F., & Liu, S. (2025). Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions. Microsystems & Nanoengineering. https://doi.org/10.1038/s41378-025-00994-4
Source records
- crossref · retrieved 2026-09-27T09:29:06.895Z