A TSV-packaged SP6T RF MEMS switch with ultra-thin profile and suppressed substrate loss for DC to Ku band application
- DOI
- 10.1038/s41378-026-01417-8
- Published
- 2026-08-28
- Container
- Microsystems & Nanoengineering
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
Credibility signals
uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- supportingDOI registered: A matching record was returned by Crossref.
- supportingDOI resolves: A matching record was returned by Crossref.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredOpen access status: Not checked or no result supplied; no credibility inference made.
- not scoredPublication license: Not checked or no result supplied; no credibility inference made.
- not scoredPublication version: A publication version was supplied but is not scored.
- supportingMetadata completeness: All 6 scored descriptive metadata groups are present.
Cite this work
BibTeX
@article{allodium:10.1038/s41378-026-01417-8,
title = {A TSV-packaged SP6T RF MEMS switch with ultra-thin profile and suppressed substrate loss for DC to Ku band application},
author = {Yulong Zhang and Jiangtao Wei and Huiliang Liu and Jianwen Sun and Qiannan Wu and Mengwei Li and Zewen Liu},
year = {2026},
journal = {Microsystems \& Nanoengineering},
doi = {10.1038/s41378-026-01417-8},
url = {https://doi.org/10.1038/s41378-026-01417-8}
}RIS
TY - JOUR TI - A TSV-packaged SP6T RF MEMS switch with ultra-thin profile and suppressed substrate loss for DC to Ku band application AU - Yulong Zhang AU - Jiangtao Wei AU - Huiliang Liu AU - Jianwen Sun AU - Qiannan Wu AU - Mengwei Li AU - Zewen Liu PY - 2026 JO - Microsystems & Nanoengineering DO - 10.1038/s41378-026-01417-8 UR - https://doi.org/10.1038/s41378-026-01417-8 ER -
APA
Zhang, Y., Wei, J., Liu, H., Sun, J., Wu, Q., Li, M., & Liu, Z. (2026). A TSV-packaged SP6T RF MEMS switch with ultra-thin profile and suppressed substrate loss for DC to Ku band application. Microsystems & Nanoengineering. https://doi.org/10.1038/s41378-026-01417-8
Source records
- crossref · retrieved 2026-11-07T18:15:05.731Z