Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions.

Singla S, Amarpuri G, Dhopatkar N, Blackledge TA, Dhinojwala A

DOI: 10.1038/s41467-018-04263-z
Published: 2018 May 22
Container: Nature communications
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1038/s41467-018-04263-z,
  title = {Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions.},
  author = {Singla S and Amarpuri G and Dhopatkar N and Blackledge TA and Dhinojwala A},
  year = {2018},
  journal = {Nature communications},
  doi = {10.1038/s41467-018-04263-z},
  url = {https://doi.org/10.1038/s41467-018-04263-z}
}

RIS

TY  - JOUR
TI  - Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions.
AU  - Singla S
AU  - Amarpuri G
AU  - Dhopatkar N
AU  - Blackledge TA
AU  - Dhinojwala A
PY  - 2018
JO  - Nature communications
DO  - 10.1038/s41467-018-04263-z
UR  - https://doi.org/10.1038/s41467-018-04263-z
ER  -

APA

S, S., G, A., N, D., TA, B., & A, D. (2018). Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions.. Nature communications. https://doi.org/10.1038/s41467-018-04263-z

Source records

pubmed · retrieved 2026-09-27T01:37:06.595Z