Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation
- DOI
- 10.1038/s41467-019-09016-0
- Published
- 2019-03-13
- Container
- Nature Communications
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s41467-019-09016-0,
title = {Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation},
author = {Donghua Liu and Xiaosong Chen and Yaping Yan and Zhongwei Zhang and Zhepeng Jin and Kongyang Yi and Cong Zhang and Yujie Zheng and Yao Wang and Jun Yang and Xiangfan Xu and Jie Chen and Yunhao Lu and Dapeng Wei and Andrew Thye Shen Wee and Dacheng Wei},
year = {2019},
journal = {Nature Communications},
doi = {10.1038/s41467-019-09016-0},
url = {https://doi.org/10.1038/s41467-019-09016-0}
}RIS
TY - JOUR TI - Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation AU - Donghua Liu AU - Xiaosong Chen AU - Yaping Yan AU - Zhongwei Zhang AU - Zhepeng Jin AU - Kongyang Yi AU - Cong Zhang AU - Yujie Zheng AU - Yao Wang AU - Jun Yang AU - Xiangfan Xu AU - Jie Chen AU - Yunhao Lu AU - Dapeng Wei AU - Andrew Thye Shen Wee AU - Dacheng Wei PY - 2019 JO - Nature Communications DO - 10.1038/s41467-019-09016-0 UR - https://doi.org/10.1038/s41467-019-09016-0 ER -
APA
Liu, D., Chen, X., Yan, Y., Zhang, Z., Jin, Z., Yi, K., Zhang, C., Zheng, Y., Wang, Y., Yang, J., Xu, X., Chen, J., Lu, Y., Wei, D., Wee, A. T. S., & Wei, D. (2019). Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation. Nature Communications. https://doi.org/10.1038/s41467-019-09016-0
Source records
- crossref · retrieved 2026-09-26T15:21:23.100Z