The role of microstructure in the thermal fatigue of solder joints

J. W. Xian, Y. L. Xu, S. Stoyanov, R. J. Coyle, F. P. E. Dunne, C. M. Gourlay

Open source

DOI: 10.1038/s41467-024-48532-6
Published: 2024-05-20
Container: Nature Communications
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1038/s41467-024-48532-6,
  title = {The role of microstructure in the thermal fatigue of solder joints},
  author = {J. W. Xian and Y. L. Xu and S. Stoyanov and R. J. Coyle and F. P. E. Dunne and C. M. Gourlay},
  year = {2024},
  journal = {Nature Communications},
  doi = {10.1038/s41467-024-48532-6},
  url = {https://doi.org/10.1038/s41467-024-48532-6}
}

RIS

TY  - JOUR
TI  - The role of microstructure in the thermal fatigue of solder joints
AU  - J. W. Xian
AU  - Y. L. Xu
AU  - S. Stoyanov
AU  - R. J. Coyle
AU  - F. P. E. Dunne
AU  - C. M. Gourlay
PY  - 2024
JO  - Nature Communications
DO  - 10.1038/s41467-024-48532-6
UR  - https://doi.org/10.1038/s41467-024-48532-6
ER  -

APA

Xian, J. W., Xu, Y. L., Stoyanov, S., Coyle, R. J., Dunne, F. P. E., & Gourlay, C. M. (2024). The role of microstructure in the thermal fatigue of solder joints. Nature Communications. https://doi.org/10.1038/s41467-024-48532-6

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crossref · retrieved 2026-09-26T19:17:43.684Z