Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics.

Lee DH, Lee S, Park M, Kim J, Jin H, Kim SY, Lee D, Lim YS, Yang JC, Lee T, Oh B, Sun SY, Kim DW, Wang S, Im SG, Kim HJ, Park SM, Kim J, Choi YK, Park S

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DOI: 10.1038/s41467-026-70101-2
Published: 2026 Feb 26
Container: Nature communications
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1038/s41467-026-70101-2,
  title = {Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics.},
  author = {Lee DH and Lee S and Park M and Kim J and Jin H and Kim SY and Lee D and Lim YS and Yang JC and Lee T and Oh B and Sun SY and Kim DW and Wang S and Im SG and Kim HJ and Park SM and Kim J and Choi YK and Park S},
  year = {2026},
  journal = {Nature communications},
  doi = {10.1038/s41467-026-70101-2},
  url = {https://doi.org/10.1038/s41467-026-70101-2}
}

RIS

TY  - JOUR
TI  - Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics.
AU  - Lee DH
AU  - Lee S
AU  - Park M
AU  - Kim J
AU  - Jin H
AU  - Kim SY
AU  - Lee D
AU  - Lim YS
AU  - Yang JC
AU  - Lee T
AU  - Oh B
AU  - Sun SY
AU  - Kim DW
AU  - Wang S
AU  - Im SG
AU  - Kim HJ
AU  - Park SM
AU  - Kim J
AU  - Choi YK
AU  - Park S
PY  - 2026
JO  - Nature communications
DO  - 10.1038/s41467-026-70101-2
UR  - https://doi.org/10.1038/s41467-026-70101-2
ER  -

APA

DH, L., S, L., M, P., J, K., H, J., SY, K., D, L., YS, L., JC, Y., T, L., B, O., SY, S., DW, K., S, W., SG, I., HJ, K., SM, P., J, K., YK, C., & S, P. (2026). Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics.. Nature communications. https://doi.org/10.1038/s41467-026-70101-2

Source records

pubmed · retrieved 2026-09-26T04:23:41.975Z