Reversibly Stacked Monolithic 3D Integrated Circuits.

Weng TT, Wang ST, Chang YC, Li KW, Chung CC, Lo CH, Tseng R, Chen SC, Chou TT, Hung TYT, Cheng CC, Radu IP, Chueh YL, Lien DH

Open source

DOI
10.1038/s41467-026-75242-y
Published
2026 Jul 9
Container
Nature communications
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.1038/s41467-026-75242-y,
  title = {Reversibly Stacked Monolithic 3D Integrated Circuits.},
  author = {Weng TT and Wang ST and Chang YC and Li KW and Chung CC and Lo CH and Tseng R and Chen SC and Chou TT and Hung TYT and Cheng CC and Radu IP and Chueh YL and Lien DH},
  year = {2026},
  journal = {Nature communications},
  doi = {10.1038/s41467-026-75242-y},
  url = {https://doi.org/10.1038/s41467-026-75242-y}
}

RIS

TY  - JOUR
TI  - Reversibly Stacked Monolithic 3D Integrated Circuits.
AU  - Weng TT
AU  - Wang ST
AU  - Chang YC
AU  - Li KW
AU  - Chung CC
AU  - Lo CH
AU  - Tseng R
AU  - Chen SC
AU  - Chou TT
AU  - Hung TYT
AU  - Cheng CC
AU  - Radu IP
AU  - Chueh YL
AU  - Lien DH
PY  - 2026
JO  - Nature communications
DO  - 10.1038/s41467-026-75242-y
UR  - https://doi.org/10.1038/s41467-026-75242-y
ER  -

APA

TT, W., ST, W., YC, C., KW, L., CC, C., CH, L., R, T., SC, C., TT, C., TYT, H., CC, C., IP, R., YL, C., & DH, L. (2026). Reversibly Stacked Monolithic 3D Integrated Circuits.. Nature communications. https://doi.org/10.1038/s41467-026-75242-y

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