Process-intrinsic cellular network for sustained strength–ductility across temperatures in a 3D-printed multi-principal-element alloy
- DOI
- 10.1038/s41563-026-02792-3
- Published
- 2026-11-02
- Container
- Nature Materials
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s41563-026-02792-3,
title = {Process-intrinsic cellular network for sustained strength–ductility across temperatures in a 3D-printed multi-principal-element alloy},
author = {Hyojin Park and Renhao Wu and Jae Heung Lee and Yoon-Uk Heo and Do Won Lee and Ji-Su Lee and Seon-Gyu Kim and Farahanz Haftlang and Sang Guk Jeong and Byeong-Joo Lee and Donghwa Lee and Hyoung Seop Kim},
year = {2026},
journal = {Nature Materials},
doi = {10.1038/s41563-026-02792-3},
url = {https://doi.org/10.1038/s41563-026-02792-3}
}RIS
TY - JOUR TI - Process-intrinsic cellular network for sustained strength–ductility across temperatures in a 3D-printed multi-principal-element alloy AU - Hyojin Park AU - Renhao Wu AU - Jae Heung Lee AU - Yoon-Uk Heo AU - Do Won Lee AU - Ji-Su Lee AU - Seon-Gyu Kim AU - Farahanz Haftlang AU - Sang Guk Jeong AU - Byeong-Joo Lee AU - Donghwa Lee AU - Hyoung Seop Kim PY - 2026 JO - Nature Materials DO - 10.1038/s41563-026-02792-3 UR - https://doi.org/10.1038/s41563-026-02792-3 ER -
APA
Park, H., Wu, R., Lee, J. H., Heo, Y., Lee, D. W., Lee, J., Kim, S., Haftlang, F., Jeong, S. G., Lee, B., Lee, D., & Kim, H. S. (2026). Process-intrinsic cellular network for sustained strength–ductility across temperatures in a 3D-printed multi-principal-element alloy. Nature Materials. https://doi.org/10.1038/s41563-026-02792-3
Source records
- crossref · retrieved 2026-11-09T04:16:53.772Z