Quantitative correlation between the void morphology of niobium-tin wires and their irreversible critical current degradation upon mechanical loading
- DOI
- 10.1038/s41598-018-24966-z
- Published
- 2018-04-26
- Container
- Scientific Reports
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s41598-018-24966-z,
title = {Quantitative correlation between the void morphology of niobium-tin wires and their irreversible critical current degradation upon mechanical loading},
author = {C. Barth and B. Seeber and A. Rack and C. Calzolaio and Y. Zhai and D. Matera and C. Senatore},
year = {2018},
journal = {Scientific Reports},
doi = {10.1038/s41598-018-24966-z},
url = {https://doi.org/10.1038/s41598-018-24966-z}
}RIS
TY - JOUR TI - Quantitative correlation between the void morphology of niobium-tin wires and their irreversible critical current degradation upon mechanical loading AU - C. Barth AU - B. Seeber AU - A. Rack AU - C. Calzolaio AU - Y. Zhai AU - D. Matera AU - C. Senatore PY - 2018 JO - Scientific Reports DO - 10.1038/s41598-018-24966-z UR - https://doi.org/10.1038/s41598-018-24966-z ER -
APA
Barth, C., Seeber, B., Rack, A., Calzolaio, C., Zhai, Y., Matera, D., & Senatore, C. (2018). Quantitative correlation between the void morphology of niobium-tin wires and their irreversible critical current degradation upon mechanical loading. Scientific Reports. https://doi.org/10.1038/s41598-018-24966-z
Source records
- crossref · retrieved 2026-09-26T11:49:22.187Z