Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating
- DOI
- 10.1038/s41598-022-25431-8
- Published
- 2022-12-06
- Container
- Scientific Reports
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
Credibility signals
serious concern Score 29/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
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- supportingDOI registered: A matching record was returned by Crossref.
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- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
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- serious concernRetraction Watch retraction: 1 retraction notice matched this DOI.
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- supportingMetadata completeness: All 6 scored descriptive metadata groups are present.
Cite this work
BibTeX
@article{allodium:10.1038/s41598-022-25431-8,
title = {Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating},
author = {Youhong Sun and Linkai He and Chi Zhang and Qingnan Meng and Baochang Liu and Ke Gao and Mao Wen and Weitao Zheng},
year = {2022},
journal = {Scientific Reports},
doi = {10.1038/s41598-022-25431-8},
url = {https://doi.org/10.1038/s41598-022-25431-8}
}RIS
TY - JOUR TI - Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating AU - Youhong Sun AU - Linkai He AU - Chi Zhang AU - Qingnan Meng AU - Baochang Liu AU - Ke Gao AU - Mao Wen AU - Weitao Zheng PY - 2022 JO - Scientific Reports DO - 10.1038/s41598-022-25431-8 UR - https://doi.org/10.1038/s41598-022-25431-8 ER -
APA
Sun, Y., He, L., Zhang, C., Meng, Q., Liu, B., Gao, K., Wen, M., & Zheng, W. (2022). Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating. Scientific Reports. https://doi.org/10.1038/s41598-022-25431-8
Source records
- crossref · retrieved 2026-09-26T00:43:50.416Z