Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating

Youhong Sun, Linkai He, Chi Zhang, Qingnan Meng, Baochang Liu, Ke Gao, Mao Wen, Weitao Zheng

Open source

DOI
10.1038/s41598-022-25431-8
Published
2022-12-06
Container
Scientific Reports
Publisher
Springer Science and Business Media LLC
Open access
unknown

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BibTeX

@article{allodium:10.1038/s41598-022-25431-8,
  title = {Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating},
  author = {Youhong Sun and Linkai He and Chi Zhang and Qingnan Meng and Baochang Liu and Ke Gao and Mao Wen and Weitao Zheng},
  year = {2022},
  journal = {Scientific Reports},
  doi = {10.1038/s41598-022-25431-8},
  url = {https://doi.org/10.1038/s41598-022-25431-8}
}

RIS

TY  - JOUR
TI  - Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating
AU  - Youhong Sun
AU  - Linkai He
AU  - Chi Zhang
AU  - Qingnan Meng
AU  - Baochang Liu
AU  - Ke Gao
AU  - Mao Wen
AU  - Weitao Zheng
PY  - 2022
JO  - Scientific Reports
DO  - 10.1038/s41598-022-25431-8
UR  - https://doi.org/10.1038/s41598-022-25431-8
ER  - 

APA

Sun, Y., He, L., Zhang, C., Meng, Q., Liu, B., Gao, K., Wen, M., & Zheng, W. (2022). Retraction Note: Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating. Scientific Reports. https://doi.org/10.1038/s41598-022-25431-8

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