Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)

Md. Khalilur Rahman, Jin-Sol Lee, Kye-Si Kwon

Open source

DOI: 10.1038/s41598-023-45083-6
Published: 2023-10-17
Container: Scientific Reports
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1038/s41598-023-45083-6,
  title = {Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)},
  author = {Md. Khalilur Rahman and Jin-Sol Lee and Kye-Si Kwon},
  year = {2023},
  journal = {Scientific Reports},
  doi = {10.1038/s41598-023-45083-6},
  url = {https://doi.org/10.1038/s41598-023-45083-6}
}

RIS

TY  - JOUR
TI  - Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)
AU  - Md. Khalilur Rahman
AU  - Jin-Sol Lee
AU  - Kye-Si Kwon
PY  - 2023
JO  - Scientific Reports
DO  - 10.1038/s41598-023-45083-6
UR  - https://doi.org/10.1038/s41598-023-45083-6
ER  -

APA

Rahman, M. K., Lee, J., & Kwon, K. (2023). Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES). Scientific Reports. https://doi.org/10.1038/s41598-023-45083-6

Source records

crossref · retrieved 2026-09-25T21:07:52.074Z