Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process.
- DOI
- 10.1038/s41598-025-14480-4
- Published
- 2025 Aug 14
- Container
- Scientific reports
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.1038/s41598-025-14480-4,
title = {Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process.},
author = {Parsons R and Jang K and Wang Y and Novick A and Smith AM and Tison CC and Gebregiorgis Y and Deenadayalan V and Niekerk MV and Carpenter L and Ngai T and Leake G and Coleman D and Meng X and Preble S and Fanto ML and Bergman K and Rizzo A},
year = {2025},
journal = {Scientific reports},
doi = {10.1038/s41598-025-14480-4},
url = {https://doi.org/10.1038/s41598-025-14480-4}
}RIS
TY - JOUR TI - Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process. AU - Parsons R AU - Jang K AU - Wang Y AU - Novick A AU - Smith AM AU - Tison CC AU - Gebregiorgis Y AU - Deenadayalan V AU - Niekerk MV AU - Carpenter L AU - Ngai T AU - Leake G AU - Coleman D AU - Meng X AU - Preble S AU - Fanto ML AU - Bergman K AU - Rizzo A PY - 2025 JO - Scientific reports DO - 10.1038/s41598-025-14480-4 UR - https://doi.org/10.1038/s41598-025-14480-4 ER -
APA
R, P., K, J., Y, W., A, N., AM, S., CC, T., Y, G., V, D., MV, N., L, C., T, N., G, L., D, C., X, M., S, P., ML, F., K, B., & A, R. (2025). Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process.. Scientific reports. https://doi.org/10.1038/s41598-025-14480-4
Source records
- pubmed · retrieved 2026-09-27T00:21:07.887Z