Unravelling Cu(6)Sn(5) precipitate coarsening mechanisms in SAC solders under thermomechanical cycling.

Cui C, Krauß S, Hosseinkhannazer H, Magnien J, Vertsanova O, Reisinger M, Imrich P, Hartner W, Brunner R

DOI: 10.1038/s41598-025-21633-y
Published: 2025 Oct 28
Container: Scientific reports
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1038/s41598-025-21633-y,
  title = {Unravelling Cu(6)Sn(5) precipitate coarsening mechanisms in SAC solders under thermomechanical cycling.},
  author = {Cui C and Krauß S and Hosseinkhannazer H and Magnien J and Vertsanova O and Reisinger M and Imrich P and Hartner W and Brunner R},
  year = {2025},
  journal = {Scientific reports},
  doi = {10.1038/s41598-025-21633-y},
  url = {https://doi.org/10.1038/s41598-025-21633-y}
}

RIS

TY  - JOUR
TI  - Unravelling Cu(6)Sn(5) precipitate coarsening mechanisms in SAC solders under thermomechanical cycling.
AU  - Cui C
AU  - Krauß S
AU  - Hosseinkhannazer H
AU  - Magnien J
AU  - Vertsanova O
AU  - Reisinger M
AU  - Imrich P
AU  - Hartner W
AU  - Brunner R
PY  - 2025
JO  - Scientific reports
DO  - 10.1038/s41598-025-21633-y
UR  - https://doi.org/10.1038/s41598-025-21633-y
ER  -

APA

C, C., S, K., H, H., J, M., O, V., M, R., P, I., W, H., & R, B. (2025). Unravelling Cu(6)Sn(5) precipitate coarsening mechanisms in SAC solders under thermomechanical cycling.. Scientific reports. https://doi.org/10.1038/s41598-025-21633-y

Source records

pubmed · retrieved 2026-09-26T08:54:43.091Z