Study on warpage stress in SiP packages during reflow soldering

R. N. Qu, D. S. Li, L. Pan, J. Xin, W. Qi, Q. H. Qin

Open source

DOI: 10.1038/s41598-026-38115-4
Published: 2026-03-20
Container: Scientific Reports
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1038/s41598-026-38115-4,
  title = {Study on warpage stress in SiP packages during reflow soldering},
  author = {R. N. Qu and D. S. Li and L. Pan and J. Xin and W. Qi and Q. H. Qin},
  year = {2026},
  journal = {Scientific Reports},
  doi = {10.1038/s41598-026-38115-4},
  url = {https://doi.org/10.1038/s41598-026-38115-4}
}

RIS

TY  - JOUR
TI  - Study on warpage stress in SiP packages during reflow soldering
AU  - R. N. Qu
AU  - D. S. Li
AU  - L. Pan
AU  - J. Xin
AU  - W. Qi
AU  - Q. H. Qin
PY  - 2026
JO  - Scientific Reports
DO  - 10.1038/s41598-026-38115-4
UR  - https://doi.org/10.1038/s41598-026-38115-4
ER  -

APA

Qu, R. N., Li, D. S., Pan, L., Xin, J., Qi, W., & Qin, Q. H. (2026). Study on warpage stress in SiP packages during reflow soldering. Scientific Reports. https://doi.org/10.1038/s41598-026-38115-4

Source records

crossref · retrieved 2026-09-26T07:27:52.386Z