Effect of metasurface and process parameters on adhesion during transfer printing using a nanoscratch test.

Park Y, Choi DG, Jung JY, Choi JH, Jeon EC

DOI: 10.1038/s41598-026-40867-y
Published: 2026 Mar 10
Container: Scientific reports
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1038/s41598-026-40867-y,
  title = {Effect of metasurface and process parameters on adhesion during transfer printing using a nanoscratch test.},
  author = {Park Y and Choi DG and Jung JY and Choi JH and Jeon EC},
  year = {2026},
  journal = {Scientific reports},
  doi = {10.1038/s41598-026-40867-y},
  url = {https://doi.org/10.1038/s41598-026-40867-y}
}

RIS

TY  - JOUR
TI  - Effect of metasurface and process parameters on adhesion during transfer printing using a nanoscratch test.
AU  - Park Y
AU  - Choi DG
AU  - Jung JY
AU  - Choi JH
AU  - Jeon EC
PY  - 2026
JO  - Scientific reports
DO  - 10.1038/s41598-026-40867-y
UR  - https://doi.org/10.1038/s41598-026-40867-y
ER  -

APA

Y, P., DG, C., JY, J., JH, C., & EC, J. (2026). Effect of metasurface and process parameters on adhesion during transfer printing using a nanoscratch test.. Scientific reports. https://doi.org/10.1038/s41598-026-40867-y

Source records

pubmed · retrieved 2026-09-26T05:51:03.138Z