Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study.
- DOI
- 10.1038/s41598-026-61096-3
- Published
- 2026 Jul 19
- Container
- Scientific reports
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s41598-026-61096-3,
title = {Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study.},
author = {Singh NSS and Hassan WH and Alaloosi W and Younis WK and Haji BS and Taner M and Salahshour S and Sajadi SM},
year = {2026},
journal = {Scientific reports},
doi = {10.1038/s41598-026-61096-3},
url = {https://doi.org/10.1038/s41598-026-61096-3}
}RIS
TY - JOUR TI - Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study. AU - Singh NSS AU - Hassan WH AU - Alaloosi W AU - Younis WK AU - Haji BS AU - Taner M AU - Salahshour S AU - Sajadi SM PY - 2026 JO - Scientific reports DO - 10.1038/s41598-026-61096-3 UR - https://doi.org/10.1038/s41598-026-61096-3 ER -
APA
NSS, S., WH, H., W, A., WK, Y., BS, H., M, T., S, S., & SM, S. (2026). Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study.. Scientific reports. https://doi.org/10.1038/s41598-026-61096-3
Source records
- pubmed · retrieved 2026-11-10T13:40:01.692Z