Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study
- DOI
- 10.1038/s41598-026-61096-3
- Published
- 2026-07-19
- Container
- Scientific Reports
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s41598-026-61096-3,
title = {Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study},
author = {Narinderjit Singh Sawaran Singh and Waqed H. Hassan and Waleed Alaloosi and Watfaa Khayri Younis and Banaz Shahab Haji and Mahmut Taner and Soheil Salahshour and S. Mohammad Sajadi},
year = {2026},
journal = {Scientific Reports},
doi = {10.1038/s41598-026-61096-3},
url = {https://doi.org/10.1038/s41598-026-61096-3}
}RIS
TY - JOUR TI - Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study AU - Narinderjit Singh Sawaran Singh AU - Waqed H. Hassan AU - Waleed Alaloosi AU - Watfaa Khayri Younis AU - Banaz Shahab Haji AU - Mahmut Taner AU - Soheil Salahshour AU - S. Mohammad Sajadi PY - 2026 JO - Scientific Reports DO - 10.1038/s41598-026-61096-3 UR - https://doi.org/10.1038/s41598-026-61096-3 ER -
APA
Singh, N. S. S., Hassan, W. H., Alaloosi, W., Younis, W. K., Haji, B. S., Taner, M., Salahshour, S., & Sajadi, S. M. (2026). Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study. Scientific Reports. https://doi.org/10.1038/s41598-026-61096-3
Source records
- crossref · retrieved 2026-09-25T23:05:23.899Z