Upcycling copper chips into Cu–Fe alloys via coating-assisted plasma sintering

M. R. Sabour, E. Taherkhani, H. Rahimi, A. R. Khatami, G. Faraji

Open source

DOI: 10.1038/s41598-026-66869-4
Published: 2026-08-15
Container: Scientific Reports
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1038/s41598-026-66869-4,
  title = {Upcycling copper chips into Cu–Fe alloys via coating-assisted plasma sintering},
  author = {M. R. Sabour and E. Taherkhani and H. Rahimi and A. R. Khatami and G. Faraji},
  year = {2026},
  journal = {Scientific Reports},
  doi = {10.1038/s41598-026-66869-4},
  url = {https://doi.org/10.1038/s41598-026-66869-4}
}

RIS

TY  - JOUR
TI  - Upcycling copper chips into Cu–Fe alloys via coating-assisted plasma sintering
AU  - M. R. Sabour
AU  - E. Taherkhani
AU  - H. Rahimi
AU  - A. R. Khatami
AU  - G. Faraji
PY  - 2026
JO  - Scientific Reports
DO  - 10.1038/s41598-026-66869-4
UR  - https://doi.org/10.1038/s41598-026-66869-4
ER  -

APA

Sabour, M. R., Taherkhani, E., Rahimi, H., Khatami, A. R., & Faraji, G. (2026). Upcycling copper chips into Cu–Fe alloys via coating-assisted plasma sintering. Scientific Reports. https://doi.org/10.1038/s41598-026-66869-4

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crossref · retrieved 2026-09-26T03:27:01.040Z