Sustainable, solvent-free exfoliation of 2D materials for thermally conductive metal powder coatings.

Koutsioukis A, Ruan S, Cabello R, Lee H, Oikonomou IΜ, Guo X, Sasnauskas A, Munuera JM, Rafferty A, Xiong Y, Parras SD, Wits WW, Yin S, Coleman J, Lupoi R, Nicolosi V

Open source

DOI: 10.1038/s41699-026-00680-7
Published: 2026
Container: NPJ 2D materials and applications
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1038/s41699-026-00680-7,
  title = {Sustainable, solvent-free exfoliation of 2D materials for thermally conductive metal powder coatings.},
  author = {Koutsioukis A and Ruan S and Cabello R and Lee H and Oikonomou IΜ and Guo X and Sasnauskas A and Munuera JM and Rafferty A and Xiong Y and Parras SD and Wits WW and Yin S and Coleman J and Lupoi R and Nicolosi V},
  year = {2026},
  journal = {NPJ 2D materials and applications},
  doi = {10.1038/s41699-026-00680-7},
  url = {https://doi.org/10.1038/s41699-026-00680-7}
}

RIS

TY  - JOUR
TI  - Sustainable, solvent-free exfoliation of 2D materials for thermally conductive metal powder coatings.
AU  - Koutsioukis A
AU  - Ruan S
AU  - Cabello R
AU  - Lee H
AU  - Oikonomou IΜ
AU  - Guo X
AU  - Sasnauskas A
AU  - Munuera JM
AU  - Rafferty A
AU  - Xiong Y
AU  - Parras SD
AU  - Wits WW
AU  - Yin S
AU  - Coleman J
AU  - Lupoi R
AU  - Nicolosi V
PY  - 2026
JO  - NPJ 2D materials and applications
DO  - 10.1038/s41699-026-00680-7
UR  - https://doi.org/10.1038/s41699-026-00680-7
ER  -

APA

A, K., S, R., R, C., H, L., IΜ, O., X, G., A, S., JM, M., A, R., Y, X., SD, P., WW, W., S, Y., J, C., R, L., & V, N. (2026). Sustainable, solvent-free exfoliation of 2D materials for thermally conductive metal powder coatings.. NPJ 2D materials and applications. https://doi.org/10.1038/s41699-026-00680-7

Source records

pubmed · retrieved 2026-09-25T18:37:07.599Z