Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board
- DOI
- 10.1038/s42004-026-02078-4
- Published
- 2026-06-26
- Container
- Communications Chemistry
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1038/s42004-026-02078-4,
title = {Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board},
author = {Yueqi Mo and Wei Lin and Yanping Zhou and Bing Qin and Xin Li and Guoxin Du and Jinrong Ye and Zhongqiang Yang and Bo Liang},
year = {2026},
journal = {Communications Chemistry},
doi = {10.1038/s42004-026-02078-4},
url = {https://doi.org/10.1038/s42004-026-02078-4}
}RIS
TY - JOUR TI - Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board AU - Yueqi Mo AU - Wei Lin AU - Yanping Zhou AU - Bing Qin AU - Xin Li AU - Guoxin Du AU - Jinrong Ye AU - Zhongqiang Yang AU - Bo Liang PY - 2026 JO - Communications Chemistry DO - 10.1038/s42004-026-02078-4 UR - https://doi.org/10.1038/s42004-026-02078-4 ER -
APA
Mo, Y., Lin, W., Zhou, Y., Qin, B., Li, X., Du, G., Ye, J., Yang, Z., & Liang, B. (2026). Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board. Communications Chemistry. https://doi.org/10.1038/s42004-026-02078-4
Source records
- crossref · retrieved 2026-09-26T14:56:21.630Z