Optimization of microstructure in high-silver content conductive inks via solvent volatilization modulation for application in flexible electronics.

Feng Q, Ma J, Shen Y, Zhou Z, Wu S, Wang J, Li J, Yang Y

DOI: 10.1039/d5ra01591j
Published: 2025 Oct 22
Container: RSC advances
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1039/d5ra01591j,
  title = {Optimization of microstructure in high-silver content conductive inks via solvent volatilization modulation for application in flexible electronics.},
  author = {Feng Q and Ma J and Shen Y and Zhou Z and Wu S and Wang J and Li J and Yang Y},
  year = {2025},
  journal = {RSC advances},
  doi = {10.1039/d5ra01591j},
  url = {https://doi.org/10.1039/d5ra01591j}
}

RIS

TY  - JOUR
TI  - Optimization of microstructure in high-silver content conductive inks via solvent volatilization modulation for application in flexible electronics.
AU  - Feng Q
AU  - Ma J
AU  - Shen Y
AU  - Zhou Z
AU  - Wu S
AU  - Wang J
AU  - Li J
AU  - Yang Y
PY  - 2025
JO  - RSC advances
DO  - 10.1039/d5ra01591j
UR  - https://doi.org/10.1039/d5ra01591j
ER  -

APA

Q, F., J, M., Y, S., Z, Z., S, W., J, W., J, L., & Y, Y. (2025). Optimization of microstructure in high-silver content conductive inks via solvent volatilization modulation for application in flexible electronics.. RSC advances. https://doi.org/10.1039/d5ra01591j

Source records

pubmed · retrieved 2026-09-25T15:31:29.486Z