Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment

Luntao Wang, Xuan Liu, Ziheng Zhao, Jialiang Song, Yuxin Shu, Honglun Wang, Yao Tan, Hao Zhang, Heqian Wang, Junsheng Wu, Kui Xiao

Open source

DOI: 10.1039/d5ra06195d
Published: 2025
Container: RSC Advances
Publisher: Royal Society of Chemistry (RSC)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1039/d5ra06195d,
  title = {Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment},
  author = {Luntao Wang and Xuan Liu and Ziheng Zhao and Jialiang Song and Yuxin Shu and Honglun Wang and Yao Tan and Hao Zhang and Heqian Wang and Junsheng Wu and Kui Xiao},
  year = {2025},
  journal = {RSC Advances},
  doi = {10.1039/d5ra06195d},
  url = {https://doi.org/10.1039/d5ra06195d}
}

RIS

TY  - JOUR
TI  - Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment
AU  - Luntao Wang
AU  - Xuan Liu
AU  - Ziheng Zhao
AU  - Jialiang Song
AU  - Yuxin Shu
AU  - Honglun Wang
AU  - Yao Tan
AU  - Hao Zhang
AU  - Heqian Wang
AU  - Junsheng Wu
AU  - Kui Xiao
PY  - 2025
JO  - RSC Advances
DO  - 10.1039/d5ra06195d
UR  - https://doi.org/10.1039/d5ra06195d
ER  -

APA

Wang, L., Liu, X., Zhao, Z., Song, J., Shu, Y., Wang, H., Tan, Y., Zhang, H., Wang, H., Wu, J., & Xiao, K. (2025). Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment. RSC Advances. https://doi.org/10.1039/d5ra06195d

Source records

crossref · retrieved 2026-09-26T01:18:04.324Z