Capillary assembly of metal-coated polymer microspheres for interconnection in electronic applications.

Huynh VL, Aasmundtveit KE, Nguyen HV

DOI: 10.1039/d5sm00446b
Published: 2025 Aug 20
Container: Soft matter
Publisher: Not recorded
Open access: no

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Cite this work

BibTeX

@article{allodium:10.1039/d5sm00446b,
  title = {Capillary assembly of metal-coated polymer microspheres for interconnection in electronic applications.},
  author = {Huynh VL and Aasmundtveit KE and Nguyen HV},
  year = {2025},
  journal = {Soft matter},
  doi = {10.1039/d5sm00446b},
  url = {https://doi.org/10.1039/d5sm00446b}
}

RIS

TY  - JOUR
TI  - Capillary assembly of metal-coated polymer microspheres for interconnection in electronic applications.
AU  - Huynh VL
AU  - Aasmundtveit KE
AU  - Nguyen HV
PY  - 2025
JO  - Soft matter
DO  - 10.1039/d5sm00446b
UR  - https://doi.org/10.1039/d5sm00446b
ER  -

APA

VL, H., KE, A., & HV, N. (2025). Capillary assembly of metal-coated polymer microspheres for interconnection in electronic applications.. Soft matter. https://doi.org/10.1039/d5sm00446b

Source records

pubmed · retrieved 2026-09-26T19:57:22.986Z
europe-pmc · retrieved 2026-09-26T19:57:23.005Z