Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives

Tong Su, Chunyu Wong, Jiashuo Liu, Yunchi Ma, Chunyu Zhang, Rong Sun, Xiaoliang Zeng

Open source

DOI: 10.1039/d6mh01210h
Published: 2026
Container: Materials Horizons
Publisher: Royal Society of Chemistry (RSC)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1039/d6mh01210h,
  title = {Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives},
  author = {Tong Su and Chunyu Wong and Jiashuo Liu and Yunchi Ma and Chunyu Zhang and Rong Sun and Xiaoliang Zeng},
  year = {2026},
  journal = {Materials Horizons},
  doi = {10.1039/d6mh01210h},
  url = {https://doi.org/10.1039/d6mh01210h}
}

RIS

TY  - JOUR
TI  - Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives
AU  - Tong Su
AU  - Chunyu Wong
AU  - Jiashuo Liu
AU  - Yunchi Ma
AU  - Chunyu Zhang
AU  - Rong Sun
AU  - Xiaoliang Zeng
PY  - 2026
JO  - Materials Horizons
DO  - 10.1039/d6mh01210h
UR  - https://doi.org/10.1039/d6mh01210h
ER  -

APA

Su, T., Wong, C., Liu, J., Ma, Y., Zhang, C., Sun, R., & Zeng, X. (2026). Entanglement-mediated bulk energy dissipation enables strong and tough UV-curable adhesives. Materials Horizons. https://doi.org/10.1039/d6mh01210h

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crossref · retrieved 2026-11-10T09:46:41.970Z