Interface engineering enhances thermal conduction and electromagnetic shielding in aramid composites

Bing Yao, Congcong Luo, Han Wang, Chunyu Zhu, Weigang Ma

Open source

DOI: 10.1039/d6nr01777k
Published: 2026
Container: Nanoscale
Publisher: Royal Society of Chemistry (RSC)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1039/d6nr01777k,
  title = {Interface engineering enhances thermal conduction and electromagnetic shielding in aramid composites},
  author = {Bing Yao and Congcong Luo and Han Wang and Chunyu Zhu and Weigang Ma},
  year = {2026},
  journal = {Nanoscale},
  doi = {10.1039/d6nr01777k},
  url = {https://doi.org/10.1039/d6nr01777k}
}

RIS

TY  - JOUR
TI  - Interface engineering enhances thermal conduction and electromagnetic shielding in aramid composites
AU  - Bing Yao
AU  - Congcong Luo
AU  - Han Wang
AU  - Chunyu Zhu
AU  - Weigang Ma
PY  - 2026
JO  - Nanoscale
DO  - 10.1039/d6nr01777k
UR  - https://doi.org/10.1039/d6nr01777k
ER  -

APA

Yao, B., Luo, C., Wang, H., Zhu, C., & Ma, W. (2026). Interface engineering enhances thermal conduction and electromagnetic shielding in aramid composites. Nanoscale. https://doi.org/10.1039/d6nr01777k

Source records

crossref · retrieved 2026-09-25T09:09:57.078Z