First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers.

Li B, Li Z, Wang S, Chen M, Qiao Y, Xiang Y

DOI: 10.1039/d6ra04171j
Published: 2026 Sep 16
Container: RSC advances
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1039/d6ra04171j,
  title = {First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers.},
  author = {Li B and Li Z and Wang S and Chen M and Qiao Y and Xiang Y},
  year = {2026},
  journal = {RSC advances},
  doi = {10.1039/d6ra04171j},
  url = {https://doi.org/10.1039/d6ra04171j}
}

RIS

TY  - JOUR
TI  - First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers.
AU  - Li B
AU  - Li Z
AU  - Wang S
AU  - Chen M
AU  - Qiao Y
AU  - Xiang Y
PY  - 2026
JO  - RSC advances
DO  - 10.1039/d6ra04171j
UR  - https://doi.org/10.1039/d6ra04171j
ER  -

APA

B, L., Z, L., S, W., M, C., Y, Q., & Y, X. (2026). First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers.. RSC advances. https://doi.org/10.1039/d6ra04171j

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pubmed · retrieved 2026-09-25T17:40:40.930Z