Ultra high barrier materials for encapsulation of flexible organic electronics

S. Logothetidis, A. Laskarakis, D. Georgiou, S. Amberg-Schwab, U. Weber, K. Noller, M. Schmidt, E. Küçükpinar-Niarchos, W. Lohwasser

Open source

DOI: 10.1051/epjap/2010102
Published: 2010-09
Container: The European Physical Journal Applied Physics
Publisher: EDP Sciences
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1051/epjap/2010102,
  title = {Ultra high barrier materials for encapsulation of flexible organic electronics},
  author = {S. Logothetidis and A. Laskarakis and D. Georgiou and S. Amberg-Schwab and U. Weber and K. Noller and M. Schmidt and E. Küçükpinar-Niarchos and W. Lohwasser},
  year = {2010},
  journal = {The European Physical Journal Applied Physics},
  doi = {10.1051/epjap/2010102},
  url = {https://doi.org/10.1051/epjap/2010102}
}

RIS

TY  - JOUR
TI  - Ultra high barrier materials for encapsulation of flexible organic electronics
AU  - S. Logothetidis
AU  - A. Laskarakis
AU  - D. Georgiou
AU  - S. Amberg-Schwab
AU  - U. Weber
AU  - K. Noller
AU  - M. Schmidt
AU  - E. Küçükpinar-Niarchos
AU  - W. Lohwasser
PY  - 2010
JO  - The European Physical Journal Applied Physics
DO  - 10.1051/epjap/2010102
UR  - https://doi.org/10.1051/epjap/2010102
ER  -

APA

Logothetidis, S., Laskarakis, A., Georgiou, D., Amberg-Schwab, S., Weber, U., Noller, K., Schmidt, M., Küçükpinar-Niarchos, E., & Lohwasser, W. (2010). Ultra high barrier materials for encapsulation of flexible organic electronics. The European Physical Journal Applied Physics. https://doi.org/10.1051/epjap/2010102

Source records

crossref · retrieved 2026-11-07T15:18:40.686Z