Bond graph multi-physics modeling of encapsulating materials in power electronic modules
- DOI
- 10.1051/epjap/2020180287
- Published
- 2020-04-23
- Container
- European Physical Journal: Applied Physics
- Publisher
- Not recorded
- Open access
- yes
Credibility signals
limited evidence Score 45/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- cautionDOI registered: No matching Crossref record was present in this response.
- cautionDOI resolves: No matching Crossref record was present in this response.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- supportingOpen access status: Normalized open-access status: open.
- not scoredPublication license: Not checked or no result supplied; no credibility inference made.
- not scoredPublication version: A publication version was supplied but is not scored.
- cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty.
Cite this work
BibTeX
@article{allodium:10.1051/epjap/2020180287,
title = {Bond graph multi-physics modeling of encapsulating materials in power electronic modules},
author = {Baptiste Trajin and Paul-Etienne Vidal},
year = {2020},
journal = {European Physical Journal: Applied Physics},
doi = {10.1051/epjap/2020180287},
url = {https://doi.org/10.1051/epjap/2020180287}
}RIS
TY - JOUR TI - Bond graph multi-physics modeling of encapsulating materials in power electronic modules AU - Baptiste Trajin AU - Paul-Etienne Vidal PY - 2020 JO - European Physical Journal: Applied Physics DO - 10.1051/epjap/2020180287 UR - https://doi.org/10.1051/epjap/2020180287 ER -
APA
Trajin, B., & Vidal, P. (2020). Bond graph multi-physics modeling of encapsulating materials in power electronic modules. European Physical Journal: Applied Physics. https://doi.org/10.1051/epjap/2020180287
Source records
- hal · retrieved 2026-09-26T04:58:21.523Z