Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire

J. Schamp, B. Verlinden, J. Van Humbeeck

Open source

DOI: 10.1051/jp4:1995326
Published: 1995-04
Container: Le Journal de Physique IV
Publisher: EDP Sciences
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1051/jp4:1995326,
  title = {Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire},
  author = {J. Schamp and B. Verlinden and J. Van Humbeeck},
  year = {1995},
  journal = {Le Journal de Physique IV},
  doi = {10.1051/jp4:1995326},
  url = {https://doi.org/10.1051/jp4:1995326}
}

RIS

TY  - JOUR
TI  - Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire
AU  - J. Schamp
AU  - B. Verlinden
AU  - J. Van Humbeeck
PY  - 1995
JO  - Le Journal de Physique IV
DO  - 10.1051/jp4:1995326
UR  - https://doi.org/10.1051/jp4:1995326
ER  -

APA

Schamp, J., Verlinden, B., & Humbeeck, J. V. (1995). Primary Recrystallization and Grain Growth of Tough Pitch Copper Wire. Le Journal de Physique IV. https://doi.org/10.1051/jp4:1995326

Source records

crossref · retrieved 2026-09-25T18:12:33.788Z