Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes

O. Dalverny, J. Alexis

Open source

DOI: 10.1063/1.5024159
Published: 2018
Container: AIP Conference Proceedings
Publisher: Author(s)
Open access: unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

supportingDOI registered: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
supportingDOI resolves: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility. Source: DOAJ; license: CC0
not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredROR affiliation: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredOpen access status: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication license: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication version: A publication version was supplied but is not scored. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
supportingMetadata completeness: All 6 scored descriptive metadata groups are present. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.1063/1.5024159,
  title = {Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes},
  author = {O. Dalverny and J. Alexis},
  year = {2018},
  journal = {AIP Conference Proceedings},
  doi = {10.1063/1.5024159},
  url = {https://doi.org/10.1063/1.5024159}
}

RIS

TY  - JOUR
TI  - Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes
AU  - O. Dalverny
AU  - J. Alexis
PY  - 2018
JO  - AIP Conference Proceedings
DO  - 10.1063/1.5024159
UR  - https://doi.org/10.1063/1.5024159
ER  -

APA

Dalverny, O., & Alexis, J. (2018). Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes. AIP Conference Proceedings. https://doi.org/10.1063/1.5024159

Source records

crossref · retrieved 2026-09-27T01:57:39.590Z