Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells
- DOI
- 10.1063/5.0056227
- Published
- 2021
- Container
- AIP Conference Proceedings
- Publisher
- AIP Publishing
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1063/5.0056227,
title = {Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells},
author = {Agata Lachowicz and Gaëlle Andreatta and Nicolas Blondiaux and Antonin Faes and Nicolas Badel and Juan J. Diaz Leon and Christophe Allébe and Charly Fontaine and Paul-Henri Haumesser and Johann Jourdan and Delfina Muñoz and Maxime Godard and Maxime Darmon and Sylvain Nicolay and Matthieu Despeisse and Christophe Ballif},
year = {2021},
journal = {AIP Conference Proceedings},
doi = {10.1063/5.0056227},
url = {https://doi.org/10.1063/5.0056227}
}RIS
TY - JOUR TI - Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells AU - Agata Lachowicz AU - Gaëlle Andreatta AU - Nicolas Blondiaux AU - Antonin Faes AU - Nicolas Badel AU - Juan J. Diaz Leon AU - Christophe Allébe AU - Charly Fontaine AU - Paul-Henri Haumesser AU - Johann Jourdan AU - Delfina Muñoz AU - Maxime Godard AU - Maxime Darmon AU - Sylvain Nicolay AU - Matthieu Despeisse AU - Christophe Ballif PY - 2021 JO - AIP Conference Proceedings DO - 10.1063/5.0056227 UR - https://doi.org/10.1063/5.0056227 ER -
APA
Lachowicz, A., Andreatta, G., Blondiaux, N., Faes, A., Badel, N., Leon, J. J. D., Allébe, C., Fontaine, C., Haumesser, P., Jourdan, J., Muñoz, D., Godard, M., Darmon, M., Nicolay, S., Despeisse, M., & Ballif, C. (2021). Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells. AIP Conference Proceedings. https://doi.org/10.1063/5.0056227
Source records
- crossref · retrieved 2026-09-25T11:02:58.781Z