Structure and properties of Sn-Cu lead-free solders in electronics packaging.

Zhao M, Zhang L, Liu ZQ, Xiong MY, Sun L

Open source

DOI: 10.1080/14686996.2019.1591168
Published: 2019
Container: Science and technology of advanced materials
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1080/14686996.2019.1591168,
  title = {Structure and properties of Sn-Cu lead-free solders in electronics packaging.},
  author = {Zhao M and Zhang L and Liu ZQ and Xiong MY and Sun L},
  year = {2019},
  journal = {Science and technology of advanced materials},
  doi = {10.1080/14686996.2019.1591168},
  url = {https://doi.org/10.1080/14686996.2019.1591168}
}

RIS

TY  - JOUR
TI  - Structure and properties of Sn-Cu lead-free solders in electronics packaging.
AU  - Zhao M
AU  - Zhang L
AU  - Liu ZQ
AU  - Xiong MY
AU  - Sun L
PY  - 2019
JO  - Science and technology of advanced materials
DO  - 10.1080/14686996.2019.1591168
UR  - https://doi.org/10.1080/14686996.2019.1591168
ER  -

APA

M, Z., L, Z., ZQ, L., MY, X., & L, S. (2019). Structure and properties of Sn-Cu lead-free solders in electronics packaging.. Science and technology of advanced materials. https://doi.org/10.1080/14686996.2019.1591168

Source records

pubmed · retrieved 2026-09-26T12:08:48.131Z
europe-pmc · retrieved 2026-09-26T12:08:48.130Z
doaj · retrieved 2026-09-26T12:08:48.103Z