Multiscale thermo-mechanical coupling in chip systems: a review.

Li L, Huang W, Yan S, Li M, Qin H

DOI: 10.1088/1361-648x/ae934d
Published: 2026 Aug 13
Container: Journal of physics. Condensed matter : an Institute of Physics journal
Publisher: Not recorded
Open access: unknown

Credibility signals

limited evidence Score 43/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

cautionDOI registered: No matching Crossref record was present in this response. Source: Crossref; license: CC0 metadata
cautionDOI resolves: No matching Crossref record was present in this response. Source: Crossref; license: CC0 metadata
not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility. Source: DOAJ; license: CC0
not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredROR affiliation: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredOpen access status: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication license: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication version: A publication version was supplied but is not scored. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.1088/1361-648x/ae934d,
  title = {Multiscale thermo-mechanical coupling in chip systems: a review.},
  author = {Li L and Huang W and Yan S and Li M and Qin H},
  year = {2026},
  journal = {Journal of physics. Condensed matter : an Institute of Physics journal},
  doi = {10.1088/1361-648x/ae934d},
  url = {https://doi.org/10.1088/1361-648x/ae934d}
}

RIS

TY  - JOUR
TI  - Multiscale thermo-mechanical coupling in chip systems: a review.
AU  - Li L
AU  - Huang W
AU  - Yan S
AU  - Li M
AU  - Qin H
PY  - 2026
JO  - Journal of physics. Condensed matter : an Institute of Physics journal
DO  - 10.1088/1361-648x/ae934d
UR  - https://doi.org/10.1088/1361-648x/ae934d
ER  -

APA

L, L., W, H., S, Y., M, L., & H, Q. (2026). Multiscale thermo-mechanical coupling in chip systems: a review.. Journal of physics. Condensed matter : an Institute of Physics journal. https://doi.org/10.1088/1361-648x/ae934d

Source records

pubmed · retrieved 2026-09-25T11:33:54.245Z