Electroless plating of copper on carbon fiber surfaces and corresponding mechanism

Qing Hui Wang, Xue Song Li

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DOI: 10.1088/2053-1591/ad695b
Published: 2024-08-01
Container: Materials Research Express
Publisher: IOP Publishing
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1088/2053-1591/ad695b,
  title = {Electroless plating of copper on carbon fiber surfaces and corresponding mechanism},
  author = {Qing Hui Wang and Xue Song Li},
  year = {2024},
  journal = {Materials Research Express},
  doi = {10.1088/2053-1591/ad695b},
  url = {https://doi.org/10.1088/2053-1591/ad695b}
}

RIS

TY  - JOUR
TI  - Electroless plating of copper on carbon fiber surfaces and corresponding mechanism
AU  - Qing Hui Wang
AU  - Xue Song Li
PY  - 2024
JO  - Materials Research Express
DO  - 10.1088/2053-1591/ad695b
UR  - https://doi.org/10.1088/2053-1591/ad695b
ER  -

APA

Wang, Q. H., & Li, X. S. (2024). Electroless plating of copper on carbon fiber surfaces and corresponding mechanism. Materials Research Express. https://doi.org/10.1088/2053-1591/ad695b

Source records

crossref · retrieved 2026-11-10T12:33:00.007Z