Multi-physical field coupling polishing of diamond for atomic-scale damage-free surface

Song Yuan, Chi Fai Cheung, Fengzhou Fang, Han Huang, Chunjin Wang

Open source

DOI: 10.1088/2631-7990/ae34fb
Published: 2026-01-28
Container: International Journal of Extreme Manufacturing
Publisher: IOP Publishing
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1088/2631-7990/ae34fb,
  title = {Multi-physical field coupling polishing of diamond for atomic-scale damage-free surface},
  author = {Song Yuan and Chi Fai Cheung and Fengzhou Fang and Han Huang and Chunjin Wang},
  year = {2026},
  journal = {International Journal of Extreme Manufacturing},
  doi = {10.1088/2631-7990/ae34fb},
  url = {https://doi.org/10.1088/2631-7990/ae34fb}
}

RIS

TY  - JOUR
TI  - Multi-physical field coupling polishing of diamond for atomic-scale damage-free surface
AU  - Song Yuan
AU  - Chi Fai Cheung
AU  - Fengzhou Fang
AU  - Han Huang
AU  - Chunjin Wang
PY  - 2026
JO  - International Journal of Extreme Manufacturing
DO  - 10.1088/2631-7990/ae34fb
UR  - https://doi.org/10.1088/2631-7990/ae34fb
ER  -

APA

Yuan, S., Cheung, C. F., Fang, F., Huang, H., & Wang, C. (2026). Multi-physical field coupling polishing of diamond for atomic-scale damage-free surface. International Journal of Extreme Manufacturing. https://doi.org/10.1088/2631-7990/ae34fb

Source records

crossref · retrieved 2026-09-25T12:28:21.306Z