Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD
- DOI
- 10.1093/mam/ozag088
- Published
- 2026-07-01
- Container
- Microscopy and Microanalysis
- Publisher
- Oxford University Press (OUP)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1093/mam/ozag088,
title = {Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD},
author = {Jia-Juen Ong and Shih-Chi Yang and Dinh-Phuc Tran and Wei-Lan Chiu and Hsiang-Hung Chang and Fang-Chun Shen and Hung-Che Liu and Pey-Ru Chiu and Wen-Wei Wu and Chih Chen},
year = {2026},
journal = {Microscopy and Microanalysis},
doi = {10.1093/mam/ozag088},
url = {https://doi.org/10.1093/mam/ozag088}
}RIS
TY - JOUR TI - Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD AU - Jia-Juen Ong AU - Shih-Chi Yang AU - Dinh-Phuc Tran AU - Wei-Lan Chiu AU - Hsiang-Hung Chang AU - Fang-Chun Shen AU - Hung-Che Liu AU - Pey-Ru Chiu AU - Wen-Wei Wu AU - Chih Chen PY - 2026 JO - Microscopy and Microanalysis DO - 10.1093/mam/ozag088 UR - https://doi.org/10.1093/mam/ozag088 ER -
APA
Ong, J., Yang, S., Tran, D., Chiu, W., Chang, H., Shen, F., Liu, H., Chiu, P., Wu, W., & Chen, C. (2026). Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD. Microscopy and Microanalysis. https://doi.org/10.1093/mam/ozag088
Source records
- crossref · retrieved 2026-11-10T11:56:44.427Z