Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
- DOI
- 10.1109/96.533908
- Published
- 1996
- Container
- IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Open access
- unknown
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uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
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Cite this work
BibTeX
@article{allodium:10.1109/96.533908,
title = {Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates},
author = {Zonghe Lai and Johan Liu},
year = {1996},
journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B},
doi = {10.1109/96.533908},
url = {https://doi.org/10.1109/96.533908}
}RIS
TY - JOUR TI - Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates AU - Zonghe Lai AU - Johan Liu PY - 1996 JO - IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B DO - 10.1109/96.533908 UR - https://doi.org/10.1109/96.533908 ER -
APA
Lai, Z., & Liu, J. (1996). Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. https://doi.org/10.1109/96.533908
Source records
- crossref · retrieved 2026-09-27T02:26:57.171Z