Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS<sub>2</sub> Materials With Physical and SPICE Model
- DOI
- 10.1109/access.2020.3034321
- Published
- 2020
- Container
- IEEE Access
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/access.2020.3034321,
title = {Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS<sub>2</sub> Materials With Physical and SPICE Model},
author = {Shunli Ma and Yan Wang and Xinyu Chen and Tianxiang Wu and Xi Wang and Hongwei Tang and Yuting Yao and Hao Yu and Yaochen Sheng and Jingyi Ma and Junyan Ren and Wenzhong Bao},
year = {2020},
journal = {IEEE Access},
doi = {10.1109/access.2020.3034321},
url = {https://doi.org/10.1109/access.2020.3034321}
}RIS
TY - JOUR TI - Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS<sub>2</sub> Materials With Physical and SPICE Model AU - Shunli Ma AU - Yan Wang AU - Xinyu Chen AU - Tianxiang Wu AU - Xi Wang AU - Hongwei Tang AU - Yuting Yao AU - Hao Yu AU - Yaochen Sheng AU - Jingyi Ma AU - Junyan Ren AU - Wenzhong Bao PY - 2020 JO - IEEE Access DO - 10.1109/access.2020.3034321 UR - https://doi.org/10.1109/access.2020.3034321 ER -
APA
Ma, S., Wang, Y., Chen, X., Wu, T., Wang, X., Tang, H., Yao, Y., Yu, H., Sheng, Y., Ma, J., Ren, J., & Bao, W. (2020). Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS<sub>2</sub> Materials With Physical and SPICE Model. IEEE Access. https://doi.org/10.1109/access.2020.3034321
Source records
- crossref · retrieved 2026-09-25T12:45:47.546Z